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ABSTRACT
A compact device allows individual or combined correction of wafer probe planarity and orientation misalignment. The device is made as a metallic block or as a strong plastic block and contains three sections, which are held together by a steel blade or by a steel blade and a rotation pin; the sections are split apart for “Phi” – orientation alignment or rotated against each-other for “Theta” planarity alignment. The steel blade provides secure and anti-backlash flexibility both in lateral (“Phi”) and perpendicular (“Theta”) direction. Alternatively the “Theta” alignment can use a rotation shaft or a small part of the original block left over as a bridge joining both sections. The device is inserted between the fixed probe support and the probe itself.
Application number: 14,108,600
Filed: 17 December 2013
Allowed: 23 December 2016
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Ruggedness
Pulsed IV Systems
Device Modeling
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