A Method for Planarity Alignment of Wafer Probes / 9,322,843

Number: 
9,322,843
Date: 
Tuesday, April 26, 2016
Abstract: 

A "Theta" angle adjustment tool is made of a solid parallelepiped and adjusting screw, that allows the wafer probes to be fastened to the auxiliary equipment under correcting "Theta" angles. The procedure consists of loosening the probe and pressing hard on the tool to force the probe to adjust to the intended slope ("Theta") and then fastening the probe under pressure against the tool and chuck surface. Following that the marks left hen the probe tips touch the wafer are assessed and corrective action is taken regarding "Theta misalignment". Read More